Shenzhen Jingkechuang Electronic Equipment Co

The general development trend of surface assembly technology is that components are getting smaller and smaller, the installation density is getting higher and higher, and the installation difficulty is becoming more and more difficult. In recent years, it has entered a new development [banned word]. In order to adapt to the development of electronic products in the direction of short, small, light and thin, a variety of new packaged components have emerged, which has triggered changes in production equipment, welding materials, mounting and welding processes, and promoted the trend of electronic product manufacturing technology. new stage.
Currently, new technological progress is being made in the following four aspects
The size of components is further miniaturized
In the mass-produced micro-electronic complete products, series components (dimensions*), Large-scale integrated circuits with new types of packages such as , , and , with narrow pin pitches have been widely adopted. As components become smaller in size, higher precision and stability requirements are put forward for surface assembly process levels and equipment positioning systems.
Further improve product reliability
Faced with the widespread adoption of micro-miniature components and the application of lead-free soldering technology, under extreme operating temperatures and harsh environmental conditions, the linear expansion coefficient of component materials must be eliminated. The stress produced by the mismatch has to be avoided to prevent the circuit board from cracking or internal disconnection, and the component welding to be damaged.
Development of new production equipment
In the mass production process of electronic products, solder paste printing machines, patch machines and reflow soldering equipment (
Solder paste thickness gauges, furnace temperature tests Yi
) is indispensable. In recent years, various production equipment are developing towards high density, high speed, high precision and multi-function, and advanced technologies such as high-resolution laser positioning, optical visual recognition systems, and intelligent quality control have been promoted and applied.
Flexible surface assembly technology
With the widespread application of flexibility in the assembly of electronic products, mounting components on flexible surfaces has been overcome by the industry. The difficulty lies in how the flexibility meets the accurate positioning requirements of rigid fixation.