Purpose: Measure the solder paste height and volume in the printing process to measure whether the process parameters of the printing machine are set correctly to provide reliable data on the printing process and confirm the stability of the printing process.
, Applicable scope technical personnel
, Operation steps
1. Check that the connection between the computer and the measurement system is good, and the power link is normal
2. Turn on the computer host and detection system
3 . When the operating system starts normally, double-click the desktop icon with the mouse to start the test program
4. Place the test belt in the appropriate position on the workbench and find the test point.
5. Move the adjustment lever up and down. When adjusting Move the rod to the middle of the reflected light of the laser line for direct measurement
6. Freeze image
7. Window setting, single-port measurement to set the detection window or click two points with the mouse to determine the two points. The displacement is made into a measurement record table
8. Detection parameter settings
9. Display or not
Solder paste thickness gauge
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