Wave soldering and surface mounting are the two main basic ways of interconnecting electronic assemblies. Among them, surface assembly technology has the characteristics of high reliability, high output and low cost, and has been recognized by the public and developed rapidly in the past ten years. However, factors such as inappropriate reflow curve settings, unreasonable material selection, and poor soldering environment may lead to a series of soldering defects, which may ultimately lead to a series of problems in electronic products.
Common soldering defects include poor wettability (missing solder, cold solder, empty solder), solder balls, tin beads, tombstones, component cracking, excessive intermetallic compound growth, and solder joint voids etc. Therefore, by understanding the various causes of defects and carrying out reasonable material and process combination and optimization, the quality of assembly welding can be improved and its long-term reliability can be ensured. With the development of high-density and fine-pitch packaging technology, as well as the replacement of high-temperature processes and materials for lead-free soldering, solder balls have become a key issue. Solder balls refer to the solder that does not form on the circuit board due to splashing and other reasons during the welding process. Scattered small balls form in necessary locations, and these small balls can cause current leakage, electrical noise, and even short circuits between two adjacent parts of the circuit board, causing long-term hazards.
From
Shenzhen Jingkechuang Electronic Equipment Co., Ltd.
Solder Paste Thickness Gauge
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